Chip-embedded antenna-in-package module using modified polyimide (MPI) low-loss materials for millimeter-wave application

نویسندگان

چکیده

In advanced millimeter-wave packaging technology, signal loss is considered the main problem, which can be resolved using low-loss circuits for minimizing transmission losses. Herein, radio frequency integrated circuit (RF-IC), an active element, and antenna are assembled in one package form to realize such a by utilizing modified polyimide (MPI) material. The material analysis of MPI reveals dielectric constant 2.5 with 0.0025 mm-waves (at 20 GHz) confirms curability proposed film at lower temperatures through differential scanning calorimetry analysis. Next, RF-IC were single verify their suitability millimeter wave package. 1 dB gain compression point (P1dB) module measured 31 dBm, 20.38 dBm RF-IC, confirming that suitable candidate as modern technology.

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ژورنال

عنوان ژورنال: AIP Advances

سال: 2023

ISSN: ['2158-3226']

DOI: https://doi.org/10.1063/5.0142050